Intel has announced a further delay in the completion of its long-awaited Ohio chip fabrication facilities, now targeting an opening for its first facility in 2030 and the second in 2031. The delays push back the original 2025 timeline set when the project was first unveiled in 2022.

The $20 billion Ohio One project, which comprises two separate chip fabs—dubbed Mod 1 and Mod 2—has seen its progress adjusted to better align with market demand and Intel’s broader business needs. In a statement, Intel said the decision to postpone the opening of Mod 1 until 2030 reflects a “prudent approach” to ensure the facilities are completed in a financially responsible manner. Mod 2 is scheduled to follow in 2031.

According to Intel, construction work has already begun on the above-ground portion of the project, following the completion of the “basement” level last quarter. The company had previously indicated to the state of Ohio that the project might be delayed until 2027 and had postponed the groundbreaking, reportedly to help incentivize the passage of the CHIPS Act in 2022.

The delays add to a challenging period for Intel, which has faced significant internal and external pressures in recent months. In December, former CEO Pat Gelsinger was replaced amid broader concerns over Intel’s aggressive expansion plans. Additionally, funding from the CHIPS Act was reduced by $600 million, and the company has navigated layoffs as it contends with heightened competition from rivals such as AMD.

With the latest postponements, Intel aims to recalibrate its chip production timeline to meet evolving market conditions while maintaining financial discipline. The company did not provide further details on specific operational adjustments or revised project milestones.

Copied